Silicone adhesives are flexible, offer good temperature and water resistance and can be used for bonding and sealing of various materials.

The curing mechanisms at the 1-component silicones are fundamentally different in:

The name acetoxy is a shortening of the name Acetyl-Oxy and describes a functional group which is derived from acetic acid,
whose odor often can be recognized when used. The group of acetoxy distinguishes itself by a fast skinning, good physical properties, excellent adhesion to most substrates without priming and high performance at high temperatures.

Oximes are organic chemical compounds, they contain as functional group of the grouping C = N-OH of the oximes.
Die is distinguished by good adhesion to most substrates including plastics, has no corrosive properties and has a faint when using

The alkoxy group is a functional group based on Alkyl.
Die associated with an oxygen atom alkyl group of the alkoxy is distinguished by completely neutral curing without showing corrosive properties.
They are suitable therefore ideal for sensitive metals and materials. For this purpose, they have an excellent unprimed adhesion along with good dielectric property.

Acetone: (New-acetone Curing)
acetone is an organic chemical compound which is generally used as a solvent.
The New-acetone-curing silicones are solvent free.
The group of Acetone is distinguished by completely neutral curing without corrosive properties exhibit an excellent unprimed adhesion, rapid adhesive curing and freedom, high performance at high temperatures and good dielectric properties.

The group of the addition silicones is with the addition of heat cured at about 100 ° C.
Good liability can be achieved by elevated temperature (from about 120 ° C) the greatest advantage is the forced fast curing by supplying heat.