Cleaning is an essential process in the electronics manufacturing production step and has been used for many years to remove potentially harmful contaminants during production and thus to ensure the necessary process reliability and product quality.

In such contaminants is flux, solder paste and adhesive residues and other common contaminants such as dust and debris caused by other production processes. The aim of cleaning, especially in the rapidly growing electronics industry, is to improve the life of products by ensuring good surface resistance. Furthermore, a failure to prevent leakage.

In industry today, many manufacturers decide for a so-called "no-clean" process. They argue that a cleaning after soldering is therefore not necessary. In the "no-clean" process, the solids content of the flux is lower than for traditional fluxes. Nevertheless, they still contain rosin and activator which are not removed before the next process, such as coating or encapsulation of the circuit board. These residues combined with other materials, which remain on the board due to lack of cleaning process may cause issues with adhesion and possibly affect the applied protective coating.